Summary
Overview
Work History
Education
Skills
Languages
academic achievement
Timeline
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Yuntao Zhao

MARKHAM,ON

Summary

Seasoned Hardware Engineer with 20+ years of experience in wireline/optical/wireless products development and maintenance. Development experience spans prototype buildup to debugging, functional verification and production customer support.

Overview

22
22
years of professional experience

Work History

Principal Hardware Engineer

MACOM solution technologies
Shenzhen, China
05.2014 - 01.2023
  • Overseeing hardware design, implementation, bring-up, and sustaining of VoIP products at MACOM
  • Provided technical consultation, reviewed customer designs, and offered on-site support
  • Worked with US team on HPA board design and bring-up/testing.

Senior System Hardware Engineer

Mindspeed Technologies China Design Center
Shenzhen, China
01.2007 - 04.2014
  • Responsible for hardware design, implementation, bring-up, and sustaining of evaluation boards based on Mindspeed devices
  • Reviewed customer designs and offered on-site support.
  • worked with US team on ASIC design validation.

Senior Application Engineer

Infineon Technologies China Co.Ltd
China, China
10.2004 - 09.2006
  • Responsible for optical,ADSL/ADSL2+ products support

Hardware R&D Engineer

Huawei Technologies Co. Ltd
China, China
09.2000 - 10.2004
  • Responsible for the development of Multi-Access service line card hardware
  • Worked on architecture design, specific design, schematic design, glue logic design, bring up, testing, and maintenance.

Education

Some College (No Degree) - Electronic Engineering Technology

Centennial College
true
04-2025

Bachelor of Science - Applied Electronics Technology

XIDIAN University
Xi'an China
07-2000

Skills

  • 20years R&D and Technical support experience in Telecom & Semiconductor fields
  • 10 years VoIP/Wireline/wireless evaluation system design with Mindspeed SOC devices (ARM based)
  • 4 years in optical communication field, mainly focus on 25G/100G/400G data rate, have knowledge and experience in high speed (up to 28Gbps) interconnecting design, layout and testing
  • Have a strong knowledge and real project experiences in TCP/IP,VOIP, GMII/RGMII/sGMII, DDR/DDR2/DDR3,ATCA/PMC/AMC/PCIe/SPI/I2C/PAM4
  • Skillful in hardware tools, for example PADS/DxDesigner,KiCAD, OrCAD/Allegro, Quartus2, Synplify, Modelsim/VCS, ISE/Vivado etc
  • familiar with CPLD/FPGA design with Verilog HDL language, understood the silicon development process
  • Can conduct signal/power integrity(SI/PI) simulation with Hyperlynx, SIwave and ADS tools
  • Possess experiences in embedded software development in C and Python on linux platform
  • Skilled in operation of lab test/soldering equipment for testing/bring-up/troubleshooting
  • With good analytical capabilities, fast-learning and troubleshooting abilities
  • Passionate, enthusiastic and dedicated in pursuing new technologies
  • Ability to adapt to change and perform under pressure or tight schedule
  • Be a good team player with intra and inter departments

Languages

  • English, good
  • Mandarin, Excellent

academic achievement

1st semester courses:

Electronics Lab instruments&technology A+

Microcontroller programming&interfacing A+

Measurement & instrumentation A+

RF communications A+

Global citizenship A+

College Communications A

GPA: 4.428

Timeline

Principal Hardware Engineer

MACOM solution technologies
05.2014 - 01.2023

Senior System Hardware Engineer

Mindspeed Technologies China Design Center
01.2007 - 04.2014

Senior Application Engineer

Infineon Technologies China Co.Ltd
10.2004 - 09.2006

Hardware R&D Engineer

Huawei Technologies Co. Ltd
09.2000 - 10.2004

Some College (No Degree) - Electronic Engineering Technology

Centennial College

Bachelor of Science - Applied Electronics Technology

XIDIAN University

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