Obtaining a position as a failure analysis engineer.
Overview
4
4
years of professional experience
Work History
Eurofins Failure Analysis Engineer
Eurofins
11.2022 - Current
Performed cross sections on solder bumps, bond wires, and passive components to verify construction
Performed inspection using SEM (Scanning Electron Microscopy)
EDS (Energy
Dispersive X-ray Spectroscopy) used for further characterization
Performed laser decapsulation on parts to prepare cavities for chemical decapsulation
Performed chemical decapsulation on parts for radiation testing
Nitric and Sulfuric acid were primary acids used
Generated quotes and wrote reports for customers using IJTS and Microsoft Office
Interfaced with customers via email.
Quality Reliability Engineer
Texas Instruments
03.2021 - 07.2022
Qualified package and die level changes in the integrated circuits
Analyzed data of tests performed on silicon chips for root cause analysis of defects
Dispositioned continuity failures of failed reliability tests.
Failure Analysis Engineer
09.2019 - 03.2021
Performed cross sections on solder bumps to check for cracks in the solder
Performed inspection
using scanning electron microscope
Performed failure analysis on continuity failures such as short and open failures on customer
return products for root cause analysis
This included preliminary analysis (Optical, X-ray, CSAM,
and CurveTrace) followed by global isolation techniques and ideally concluding with capturing an
EOS site using topside decapsulation or backside Laser Scanning Microscopy
Generated lengthy reports summarizing analysis results for customers and key internal
stakeholders.
Education
Bachelor of Science, BS - Electrical Engineering
University of Texas
Richardson, TX
05.2019
Skills
Software and Standards
Microsoft Office Proficiency, IJTS(Quote writing software)
Preliminary knowledge of ISO 9000
Tool Knowledge
Compound Microscopes, X-ray, CSAM, Curve Trace, SEM (EDS and Microscopy),
SOM (OBIRCH), QFI (Hotspot mapping), Chemical Decapsulation (Nitric and Sulfuric