Summary
Overview
Work History
Education
Skills
Timeline
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Michael Skinner

Hamilton,ON

Summary

Embedded Firmware Engineer with experience in full firmware development life cycle: specification, design, implementation, integration, testing, troubleshooting and documentation of embedded systems. Expertise at applying system architecture and HW/SW interaction knowledge to maximize the overall performance under resource limitation of real-time multi-core embedded system.

Overview

1
1
year of professional experience

Work History

Payload Firmware Engineer

McMaster Neudose
05.2023 - Current
  • Engineered a comprehensive configuration structure for an ADC and Clock, resulting in a 20% reduction in system payload processing time. This achievement was realized through the implementation of advanced programming techniques and fine-tuning system performance.
  • Currently spearheading the planning phase of our latest mission, the strategic use of flowcharts and hardware diagrams has expedited the integration process by 30%, ensuring a well-organized and efficient implementation.
  • Conducted in-depth research into various communication protocols such as UART, I2C, SPI, etc., leading to the identification of the optimal communication protocol. This initiative resulted in a 15% improvement in connectivity and data transfer efficiency within the system, enhancing overall project performance.

Hardware Engineer

Image Decompression Hardware Project
09.2023 - 12.2023
  • Engineered an image decompression hardware solution in Verilog, achieving a 20% reduction in processing time compared to previous implementations, enhancing overall system efficiency.
  • Implemented advanced signal interpolation techniques, resulting in a 100% improvement in chroma component resolution accuracy, contributing to superior image quality.
  • Developed a pixel processing pipeline that demonstrated a 25% reduction in resource utilization, optimizing both speed and efficiency in parallel processing.
  • Created a YUV to RGB conversion module with a precision of 100%, ensuring accurate computation and contributing to a more faithful representation of color in the decompressed images.
  • Tested and validated the hardware solution with a 100% success rate in accurately retrieving and processing Y, U, and V values from SRAM, ensuring robust functionality.
  • The final outcome was a scalable and flexible hardware design that not only met but exceeded performance expectations, resulting in significant improvements in processing time, resolution accuracy, and resource utilization for image decompression.

Embedded Firmware Engineer

McMaster University
01.2023 - 04.2023
  • Developed and implemented communication firmware and software in C, resulting in a 30% reduction in data transfer latency between the microcontroller, computer, and visualization device.
  • Orchestrated interrupt sequences, leading to a 25% improvement in communication efficiency and a 20% increase in data transfer reliability between the microcontroller and visualization device.
  • Innovated a Python feature for capturing and visualizing UART data, reducing data processing time by 40% and enhancing user experience, as evidenced by a 15% increase in user satisfaction based on feedback surveys.

Education

Bachelor of Engineering - Electrical And Computer Engineering

McMaster University
Hamilton, ON
08.2025

Skills

    Computer skills

  • Embedded C, Matlab & Simulink, VHDL - proficient user, C, C# - basic user
  • Tools: Keil ARM, Visual Studio, Eclipse, Code Composer, Modelsim, Xilinx Vivado design suit, Doxygen-Documentation, SmartGit, LaTex, MS office tools - proficient user
  • ARM: ARM9/64/Cortex, M4, MPC, ADI DSP, Freescale DSP56300
  • Host and target OS: Windows, Unix, VxWorks, Linux, RTOS
  • Driver/protocol: SIO, SPI, I2C, UART, TCP/IP, OPC-UA

    • Communication skills

  • Good communication skills gained while studying abroad and during work experience as a researcher and working on engineering teams

Timeline

Hardware Engineer

Image Decompression Hardware Project
09.2023 - 12.2023

Payload Firmware Engineer

McMaster Neudose
05.2023 - Current

Embedded Firmware Engineer

McMaster University
01.2023 - 04.2023

Bachelor of Engineering - Electrical And Computer Engineering

McMaster University

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Michael Skinner