
Dedicated semiconductor manufacturing operator at Integra Technologies in Milpitas with hands-on experience in Saw, Backgrind, and Pick and Plate operations. Strongest in the Saw department, where precision, consistency, and attention to detail are critical, and where I take pride in producing high-quality results. Experienced in wafer processing, equipment operation, and cleanroom protocols while consistently meeting quality and production standards. Known by my team as a quick learner who is dependable, adaptable, and willing to step into different roles as needed. I bring a strong work ethic, problem-solving mindset, and a genuine commitment to doing the job right and supporting the team’s success.
I worked at Integra Technologies in Milpitas and gained hands-on experience in three production departments: Saw, Backgrind, and Pick and Plate. My primary strength is in the Saw department, where I operated wafer sawing equipment, followed work instructions closely, and maintained high standards for accuracy, quality, and throughput. I also supported Backgrind operations, assisting with wafer thinning processes and handling wafers with care to prevent damage. In the Pick and Plate department, I performed precise component handling and placement while meeting production goals in a fast-paced cleanroom environment. Working across multiple departments helped me build a strong understanding of semiconductor manufacturing flow, sharpen my attention to detail, and become a reliable team member who adapts quickly to different processes.
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