Detail-oriented and dependable professional with recent hands-on experience as a Microelectronic Assembler, skilled in precision assembly of electronic components using wire bonding, soldering, and epoxy techniques. Adept at working under microscopes, operating specialized equipment, and following cleanroom and ESD protocols to meet strict quality standards. I bring a strong background in team leadership, training, and process improvement from previous managerial roles, with excellent communication and multitasking abilities. Proven ability to adapt quickly, solve problems on the line, and consistently meet production goals in fast-paced environments.